C-Base

For Heat-Seal Bonding, Reflow soldering, ACF Laminating and Heat-Staking applications.

The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control, all packaged into an easy to use, multi-language, touch screen interface. Whether you require a system for Heat- Seal Bonding, Reflow soldering, ACF Laminating, Heat-Staking, or other demanding application, the C-Flow can get the job done. The C-Flow was designed for easystand-alone applications and complete factory integration with ModBus or OPC-UA compact size, and external I/O. The C-Flow is a revolutionary concept in intelligent pulsed heat controllers. It is an industry first, by combining precision temperature control with micron level displacement monitoring and real time control of thermode pressure, providing its users with capabilities usually requiring multiple pieces of equipment. The C-Drive is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C- Flow Controller, the C-Drive shows its true colors. Temperature, Force, and Displacement Monitoring give instant feedback on what’s occurring at the joint on a full color touch screen display, alarming the operators instantly if the temperature and displacement are out of specifications. The C- Drive series was engineered to deliver repeatable and accurate force for a wide range of applications. For Heat-Seal Bonding, Reflow soldering, ACF Laminating and Heat-Staking applications Desktop C-Base The C-Flow is a revolutionary concept in intelligent pulsed heat controllers. The C-Drive is designed to deliver quality solder joints and heat seal bonds consistently. c-techsystems.com Call us now! +31 088 782 3000

Features

• Multi-language user-friendly touchscreen UI
• Easy Thermode change overs and planarity
• Three distinct force ranges
• Data output to PC
• Optional integrated Force Control
• Optional Interposer module
• Optional displacement monitoring

Benefits

• Control your joining connections
• To easily transfer proven process
• Saving set up time
• Accurate forces for all applications
• Easy force programming by touch screen
• For Quality Assurance and SPC collection
• All possible process requirements con trolled by one controller.