Pneumatic Bond Head with Displacement Monitoring
The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, Temperature, Force, and Displacement Monitoring give instant feedback on what’s occurring at the joint.
The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, the C-Drive shows its true colors. Temperature, Force, and Displacement Monitoring give instant feedback on what’s occurring at the joint on a full color touch screen display, alarming the operators instantly if the temperature and displacement are out of specifications.
The C-Drive series was engineered to deliver repeatable and accurate force for a wide range of applications. Four different models are available: extremely low forces for delicate applications to very high forces for the most challenging heat seal connectors.
C-Tech Systems Innovative Design results in quicker and simpler operation with easily adjusted planarity and rapid hot bar change overs, making the C-Drive an ideal candidate for all environments; from prototyping labs to full production. The C-Drive was developed to revolutionize the bench-top bonding heads by providing features and precision normally found in complete turnkey systems but at an affordable cost.
- Easy Thermode change overs and planarity
- Four distinct force ranges
- Displacement Monitoring
- Integrated Force Control
- Possibility to be equipped with cameras and interposer feeder
- Heat Seal Bonding
- Reflow Soldering
- Heat Staking
- From delicate applications to the most challenging heat seal connections