C-Drive

C-TECH SYSTEMS

C-Drive

C-Drive

Pneumatic Bond Head with Displacement Monitoring

The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, Temperature, Force, and Displacement Monitoring give instant feedback on what’s occurring at the joint.

The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, the C-Drive shows its true colors. Temperature, Force, and Displacement Monitoring give instant feedback on what’s occurring at the joint on a full color touch screen display, alarming the operators instantly if the temperature and displacement are out of specifications.

The C-Drive series was engineered to deliver repeatable and accurate force for a wide range of applications. Four different models are available: extremely low forces for delicate applications to very high forces for the most challenging heat seal connectors.

C-Tech Systems Innovative Design results in quicker and simpler operation with easily adjusted planarity and rapid hot bar change overs, making the C-Drive an ideal candidate for all environments; from prototyping labs to full production. The C-Drive was developed to revolutionize the bench-top bonding heads by providing features and precision normally found in complete turnkey systems but at an affordable cost.

Features

  • Easy Thermode change overs and planarity
  • Four distinct force ranges
  • Displacement Monitoring
  • Integrated Force Control
  • Possibility to be equipped with cameras and interposer feeder

Applications

  • Heat Seal Bonding
  • Reflow Soldering
  • Heat Staking
  • From delicate applications to the most challenging heat seal connections
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