C-Slide

For Heat-Seal Bonding, Reflow soldering, ACF Laminating and Heat-Staking applications.

The Desktop Series is a product range for Heat-Seal Bonding, ACF Laminating process applications and Reflow Soldering. All kind of LCD, Flex foil and PCB connections can be made using these systems. C-Tech Systems has the most intelligent system designs, very rigid base constructions with exchangeable soldering/bonding heads which minimizes your production down time when switching over to another head. But more revolutionary are the exchangeable product movement modules! You don’t need to buy a complete new desktop, only a product movement module which will be a considerable cost benefit for you. They make it possible for you to up-grade your C-Slide to a C-Prime or C-Turn in minutes. For Heat-Seal Bonding, Reflow soldering, ACF Laminating and Heat-Staking applications Desktop C-Slide C-Slide handles the product in a pneumatic slide for easy access and preparation of the application. c-techsystems.com Call us now! +31 088 782 3000

Features

• Most rigid frame construction
• Smartest Hot Bar exchange design
• Exchangeable product handling and process modules
• User-friendly touchscreen, easy programmable
• Pulsed heat temperature controller for time, temperature and force
• Multiple user logins and levels

 Options

• Automatic force control
• Soldering/Bonding Head Modules in different force ranges for optimal process adjustment
• Interposer Module for soldering and bonding processes
• Product Alignment for fine pitch applications
• Quality control modules, displacement measurement
• Camera module
• Flux module

Benefits

• High performance processing
• Maximum flexibility for upgrades and new products
• Set up is easy and takes seconds
• Process quality control is guaranteed by pulsed heat closed loop temperature control
• Possibility for factory integration trough ModBus or OPC-UA communication